|
PCB（雙麵板/多層板）製程工藝能力 |
序號
No. |
工序 Process |
項目 Item |
製程能力 Process capability |
|
1 |
層數 Layer |
壓合 Pressing plate |
1-20 |
|
2 |
板材 Material |
板材類型 Material Type |
FR4 |
|
3 |
板厚
Board thickness |
成品板厚度 Finished board thickness |
0.15-4.0mm |
|
4 |
開料 Cutting |
最大拚板尺寸 The Max. panel size |
540×620mm |
|
5 |
內層
Inner layer |
內層最小線寬/線距 Min. trace width/distance |
2.5/2.5mil |
|
內層最小銅箔厚度 Min. thickness of copper foil |
1/3OZ - 2OZ |
|
內層對準度 Inner alignment |
±0.05mm |
|
線路對位偏差 Registration deviation |
0.025mm |
|
內層孔邊距線邊 Inner hole edge & margin line |
0.33mm |
|
內層銅皮距板邊 Inner layer copper - plate edge |
0.5mm |
|
6 |
鑽孔
Drilling |
鑽咀 Drill tip |
0.15mm-6.0mm |
|
最小孔徑 The smallest aperture |
0.15mm |
|
孔徑公差 PTH diameter tolerance PTH |
±0.05mm |
|
孔徑公差 NPTH diameter tolerance NPTH |
±0.025mm |
|
縱橫比 Aspect ratio |
10:1 |
|
7 |
外層
Outer Layer |
最小線寬/線隙 Min. trace width/gap |
0.076mm/0.076mm |
|
基板銅厚 Base copper thickness |
1/3OZ -4OZ |
|
線路對準度 Registration tolerance |
±0.05mm |
|
阻抗控製公差 Impedance control tolerance |
±10% |
線到線路邊距離
Line to line edge distance |
0.4mm |
孔環到線邊最小距離
The Min distance from PTH ring to edge of line |
0.15mm/0.15mm |
|
線到線距離 Line to line |
0.1mm |
|
線到PAD距離 Line to PAD |
0.1mm |
|
到PAD距離 PAD to PAD PAD |
0.1mm |
|
線路到外形距離 The distance from panttern edge to PCB outline |
鑼板 Routing |
0.2mm |
|
衝板 Punching |
0.3mm |
|
8 |
防焊
Solder resist |
最小防焊厚度（除特殊要求）
Min. soldmask thickness(without special Req.) |
0.01mm |
防焊開窗到線邊距離
The distance from pattern edge to soldmask opening |
0.10mm |
|
最小防焊橋大小 Min solder resistant bridge(green oil) |
0.10mm |
|
最小防焊開窗大小 Min. solder resistant opening |
0.08mm |
|
防焊對準度 Registration tolerance |
±0.05mm |
|
塞孔能力 Via hole plug capability |
≤0.6mm |
|
9 |
絲印
Silkscreen |
最小字符寬度 Min. silkscreen width |
0.13mm |
|
最小字符高度 Min. silkscreen height |
0.8mm |
|
10 |
表麵處理
Surface finished |
OSP厚度 OSP Thickness |
0.2-0.5um |
|
沉錫厚度 Immersion SN Thinckness |
0.8 - 1.0um |
|
沉銀厚度 Immersion Silver Thinckness |
0.8 - 1.0um |
|
無鉛噴錫厚度 PB free HAL Thinckness |
≧1.0um |
|
沉金 Enig(without special Req.) |
金厚 Au thickness |
0.025-0.1um |
|
鎳厚 Ni thickness |
5um |
|
11 |
成型
Profilling |
最小槽孔 Min. slot hole |
0.8mm |
|
最小鑼刀大小 Min. routing cut size |
0.8mm |
|
最大鑼刀大小 Max. routing cut size |
1.6mm |
|
外型公差 Contour tolerance |
鑼板 Routing |
0.15mm |
|
衝板 Punching |
0.05mm |
|
角度公差 V-CUT angle tolerance V-CUT |
± 5° |
|
餘厚公差 V-CUT core thickness V-CUT |
±0.05mm |
|
最小V-CUT尺寸 Min V-CUT Size |
70×70mm |
|
衝板厚最小外型尺寸 Min connector size after punching profile |
1.0mm |
|
最小衝槽 Min Punching slot |
1×2mm |
|
衝孔刀衝槽距離 Distance from Punching hole to Punching Slot |
0.6mm (基板厚度Laminate thickness ≤ 1.2mm) |
|
1.6mm 1.6mm |
|
12 |
成品
Finished Board |
厚度公差 Thickness tolerance |
± 5% |
|
板翹曲公差 Wrapping tolerance |
≤0.5% |
製程能力
雙麵&多層板
